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M25SI
Vishay Draloric
Fusible Thin Film Chip Resistor
FEATURES
? Metal film on high quality ceramic
? Special protective top coat
? Flame retardant
? Sn solder contacts on Ni barrier layer
? Fusible resistor for constant voltage
? Automatic placement compatibility
? Compliant to RoHS directive 2002/95/EC
M25SI fusible thin film chip resistors are designed for
overload protection in modern professional electronics.
Typical applications include automotive, telecommunication
METRIC SIZE
and industrial equipment.
TECHNICAL SPECIFICATIONS
DESCRIPTION
Metric size
Resistance range
Resistance tolerance
Temperature coefficient
Climatic category (LCT/UCT/days)
INCH:
METRIC:
M25SI
RR 3216M
5 Ω to 3.9 k Ω
±5%
± 100 ppm/K
55/125/56
1206
RR 3216M
Rated dissipation, P 70
(1)
0.25 W
Limiting element voltage, U max. DC/AC RMS
Maximum permissible film temperature
Insulation voltage (1 min), U ins DC/AC peak
Thermal resistance (2)
Insulation resistance
Failure rate
E-Series
P x R
125 °C
> 300 V
≤ 220 K/W
> 10 9 Ω
≤ 1 x 10 -9 h -1
24
Notes
(1) The power dissipation on the resistor generates a temperature rise against the local ambient, depending on the heat flow support of the
printed-circuit board (thermal resistance). The rated dissipation applies only if the permitted film temperature is not exceeded. Furthermore, a
high level of ambient temperature or of power dissipation may raise the temperature of the solder joint, hence special solder alloys or board
materials may be required to maintain the reliability of the assembly.
(2) Measuring conditions in accordance with EN 140401-801
? Marking: 3 digits
? Tolerance 1 % on request
? Beige top coat
PULSE TEST DATA
Pulse power (square pulse)
Pulse duration t i
Pulse pause t p
Number of pulses
Drift after pulse test
Document Number: 20031
Revision: 17-Sep-09
0.9 W
100 μs
100 ms
10 5
< 0.1 %
For technical questions, contact: thinfilmchip@vishay.com
0.3 W
100 ms
1s
10 5
< 0.1 %
www.vishay.com
235
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